Heat pipe radiator for eliminating heat of electric component

ABSTRACT

A kind of heat pipe radiator for eliminating heat of exothermic electronic elements includes a tubular shell with a tubular, thin-wall fluid passage, which is set inside the said shell, and the edge of which, by an end plate, is airtight sealed with the edge of the said shell, in order to form an enclosed space between the inner wall of the said shell and the outer side of the said thin-wall fluid passage. And this enclosed space is vacuumed, filled with fluid medium. Heat eliminating fins are set in the said thin-wall fluid passage. There is a fluid suction core set inside the said enclosed space. There is an injection port, designed on the said end pale or on the said shell, which is used for vacuumizing or for filling of the said working fluid medium. This practical, new pattern applies the principle of heat transfer with heat pipe, using the heat radiation fins in the thin-wall fluid passage to form a space of heat elimination network. This new pattern adopts simple structure and has features of swift heat transfer and even heat conduction, easy-use and high reliability, and can be transformed to various types according to the electric components in different situation, to meet the requirements of different equipments.

FIELD OF INVENTION

This practical new pattern is related to a kind of heat radiator, especially a kind of integrated heat pipe radiator for eliminating heat of exothermic electronic elements, which features three-dimensional heat condensation-radiation network, through way of adjusting the heat radiation fin and fluid suction core, and the total layout of the heat pipes.

BACKGROUND OF THE INVENTION

As the rapid development of electronic and electrical technologies, especially the higher extent integration of integrated circuit, the heat elimination of electronic elements and components has become one of the important problems that restrict the operation speed and output power of electronic equipments.

For example, the integration level of CPU chips computers has raised nearly 20,000 folds just within 30 yeas with the resulting heat flux rising up to 100 W/cm² in some cases.

It is well known that the working reliability and life of a computer is closely related to its working temperature, and that the more higher integration level of the chips, the more quantity of heat it will produce. The work reliability of a computer may be reduced greatly, or even the worst the abnormal running condition will occur for the computer, if the heats flux cannot be eliminated in good time. Computer development and research institutions still cannot develop and fabricate more compact data processing devices with faster speed and higher power if they are not able to effectively solve the problem of heat elimination of the chips and other electronic elements and components.

At present, the commonly used method to eliminate heat radiation from computer or other electronic elements is to install a pectinated heat eliminating board onto the body of chips or other electronic elements to form a larger area of heat elimination to reduce temperature, with the aid of fan. Though this way of heat elimination is simple of structure and low cost, it is only suitable for heat elimination of elements in electronic devices of low operation speed and power.

In 1998, The State Laboratory of Sandia in the U.S.A applied the heat pipe technology in heat elimination of computer chips, which produced fine heat elimination effect.

FIG. 1 illustrates a kind of heat elimination device with heath pipe presently used, which includes a case frame 1, which has several heat radiation fins 2 made of metal sheet installed on its baseboard and crowded deployed. On the baseboard of the case 1 there setup heat pipes 3 (which can be two or three). The heat pipes 3 go downward through the lower side of heat radiation fins 2, and then turn 180 degree upward and ten go into the upper side of the heat radiation fins 2. All of the heat radiation fins 2 are closely connected to and pressed against heat pipes 3, which are filled with fluid medium that will be vaporized in higher temperature or condensed in lower temperature. When case frame 1 is installed onto the chip, the fluid medium in heat pipe 3 lying on the baseboard of case frame 1 will be vaporized heat flux from the chip, thus the heat flux will penetrate into heat pipe 3 in the upper side of the heat radiation fins 2, because of vaporization of the fluid medium, and be condensed there when low temperature, while the heat will radiate into outside through the heat radiation fins. If the heat radiation fins 2 have a forced cooling fan 4 installed on its upper side, the heat elimination will be better then.

Because of high heat transfer efficiency of the hest pipe, the heat flux from the chip can be quickly transferred onto the heat elimination fins beyond, thus to achieve the heat elimination effect. This way of heat elimination may gain better heat elimination efficiency than the conventional pectinated heat eliminating board. Because of the reason that, on the pectinated heat elimination board, the temperature on the part far away from the chip is usually lower than that on the part close to the bottom of the chip, this situation of temperature ladder wastes a lot of area of heat elimination, therefore, it cannot achieve higher heat elimination efficiency. The adoption of heat pipe technology, however, can overcome the disadvantage of heat elimination that the pectinated elimination board has.

Although the heat pipe heat elimination device shown in FIG. 1 has better effect of heat elimination, this way of heat elimination still cannot meet the requirements of heat elimination raised by SLSC, large power electronic elements, and high-speed chips, just because of its born structure deficiency (there are higher heat resistances between heat source and baseboard, heat pipe and baseboard, and heat pipe and fins.) and that, the fin cannot be made very thin when the strength of the heat elimination device is concerned. Furthermore, not only thick fins waste material and take up the already limited space, but also they cannot obtain additional heat elimination areas, so that its application and development are somewhat limited.

Thereby, one of the problems urgently to be solved for people in this field is how to use the heat transfer principle of heat pipe to design and fabricate heat elimination device with more heat elimination efficiency to meet the higher requirements of heat elimination for the electronic elements and components.

DETAILED DESCRIPTION OF THIS PRACTICAL NEW PATTERN

The object of this practical new pattern is to provide a kind of heat pipe radiator for heat elimination of electronic elements, opposing at the present conventional heat elimination device that cannot fulfill the complete requirements of heat elimination of electronic elements and components and cannot couple with the fast development of today's electronic technology. The said heat elimination device, applying the heat pipe principle of quick heat transfer with fluid and establishing condensing network in three-dimensional space, is to make optimum matching and assorting between the heat elimination area and the heat flux from heat source, thus to provide a new way for solving the heat elimination problem for electronic elements.

The goal of this practical new pattern is realized by the following technical schemes:

A kind of heat pipe radiator for eliminating heat of exothermic electronic elements includes a tubular shell and also a thin-wall fluid passage, which is placed inside the said shell, and the edge of which is sealed coupled with the edge of the said shell by way of end plate, so as to form an enclosed space between the inner wall of the said shell and the outer side of the said thin-wall fluid passage. The enclosed space is vacuumized and filled with fluid medium that will be vaporized in higher temperature or condensed in lower temperature.

The inside the thin-wall fluid passage is fixed with more than one layer of heat radiation fins for the coolant fluid to carry away the heat flux when passing by. The fluid suction core, laid in the enclosed space facing the inner side of the said shell, has gaps that will produce capillarity capable of fluid suction and spreading.

On the end plate there is a lead-in bonnet designed for vacuumizing and filling of the said fluid medium and will be sealed after the said enclosed space is vacuumized and filled with the said fluid medium.

The said shell can be made of metal or organic materials with good heat conduction capability. In practice, upon heat eliminating and temperature reducing of the exothermic electronic elements, the surface of the said shell is closely pressed against the heat radiation surface of the exothermic electronic elements so as to embrace the heat radiation surface of the exothermic electronic elements as a heat source, and that, when the heat flux is transferred through the shell to the said fluid medium, some of the fluid medium will be vaporized and the remained will gather around the heat source to continue the process of vaporization. The vaporized fluid medium will carry heat quickly to any place inside the enclosed space and transfer heat flux onto the said heat radiation fins when meet the outer surface of the thin-wall passage with lower temperature and at the same time returns itself to condensed liquid sate, and then flows back to, or through fluid suction core, restores to initial place. If the heat radiation surface of the exothermic electronic elements is not closely placed onto the place the position filled with fluid medium, the fluid medium still can be gathered around by the capillarity of the fluid suction core.

The heat radiation fins enlarge the heat elimination area of the exothermic electronic elements and will achieve better effect if there is cold wind blowing by the thin-wall fluid passage.

The above said shell can be made tubular of rectangle or round or hexagon or any kind of tubular shape according to actual need.

The fluid suction core can be composed of weaved multi-layer fiber meshwork or laminated metal mesh, or micro-pored plate-like body of sintered powder material. And the fluid suction core can be laid onto the inner surface of the said shell by way of welding or conglutinating.

The other type of fluid suction core is a kind of belt body made of metal or organic sheet by alternative folding or bending. Holes are made on the thin sheet, which can be placed on the inner wall of the said shell by welding or conglutinating the peripheries of the sheet. This type of fluid suction core not only has the feature of absorbing fluid medium that the above said fluid suction core has, but also immediately takes part in heat transfer and conduction medium itself, especially when made of metal sheet. For thin metal sheet itself has good heat conductibility and can make direct vaporization of the fluid medium some way far from the heat source, so as to improve heat conductibility, and thereby, to further enhance the heat elimination efficiency of the heat pipe radiator on the exothermic electronic elements greatly.

In the said technical scheme above, the composition of that can be one or more than one thin-wall passage according to practical heat elimination requirements. The edge of the said end plate is sealed connected to the edges of several thin-wall fluid passage and that of the shell, thus to form a run-through enclosed space between the thin-wall fluid passage and the inner wall of the said shell and among the outer sides of the many thin-wall fluid passages.

When the volume of the shell and the number of the layers of the heat radiation fins are fixed, setting of several thin-wall fluid passages sure will reduce the total heat elimination area of the heat radiation fins but can increase the volume of enclosed space, therefore can be benefit for vaporization and heat transfer of the fluid medium. The decision of the number of the thin-wall fluid passages is depended on requirement of matching the heat flux form the heat source with the quantity of heat elimination ability. Therefore, to modulate the number of the thin-wall fluid passages can achieve the most optimized design of heat elimination. In addition, to revise the section profile of the thin-wall fluid passage, for example, to rectangle or round or hexagon or other shape, can efficiently use the already limited space so as to make ensure that the space volume for the coolant fluid to flow in the thin-wall fluid passage is equal to or two times larger than the volume of the enclosed space.

The thin-wall fluid passage can be made of metal material having good heat conductibility.

To ensure firmness of the heat radiation fins, a supporting rod or board of metal material can be setup inside the thin-wall fluid passage, where the supporting rod or board, through the said heat radiation fins, is fixed onto the inner side of the said thin-wall fluid passage, and to make firm connection of the heat radiation fins with the said supporting rod or board.

Still, a thin-wall heat pipe of metal material can be setup inside the thin-wall fluid passage, wherein the said thin-wall heat pipe will go through and be closely coupled with the said heat radiation fins, and the two ends of it will be fixed onto the inner wall of the said thin-wall fluid passage and run through the said enclosed space. In this way, it cannot make the heat radiation fins effectively fixed with, but also can use the thin-wall heat pipe to transfer heat to the heat radiation fins, that is, it has actually increased the volume of the enclosed space and the area transferring heat flux to heat radiation fins, thus it can achieve quiet fine heat elimination effect.

In the scheme above said, the end plate is an important part for sealing the said enclosed space. In order to seal the enclosed space tightly and for convenience of large-scale fabrication, the surface fringes of the said end plate can be made into the shape flange for the convenience of welding or conglutinating it onto the inner wall of the said shell and the ledges of the outer surface of the said thin-wall fluid passage. The ledges can be setup inward or outward of the enclosed space. The design of the ledges can totally enhance the strength of the heat pipe radiator on the exothermic electronic elements, and it is suitable for large-scale fabrication.

The said heat radiation fins are made of metal sheets that may be shaped undee, or they can be a type of heat radiation fin stack composing of lapped metal sheets of ‘Z’ shape by alternative bending. On the surface of the said heat radiation fin there can set up pass-by holes for cooling fluid to flow or upright barbs on the surface to make turbulent flow, to get better heat elimination effect.

To further enhance heat elimination efficiency, a forced cooling fan also can be installed on the outer of the thin-wall fluid passage of the heat pipe radiator on the exothermic electronic elements, wherefore, a lead-in bonnet can be deployed on the edge of the said shell for the purpose of leading the cooling flow from the cooling fan into the thin-wall fluid passage, thus, the profile of the lead-in bonnet is identical to the shape of the said shell or the thin-wall fluid passage.

The technical scheme described in this practical new pattern can also fulfill heat elimination for several exothermic electronic elements at the same time. In order to enhance heat transfer efficiency from exothermic electronic elements into the shell, one or several heat conduction boards that can be closely pressed against the heat radiation surface of the exothermic electronic elements outside can fixed on the said shell, and the said heat conduction board is embedded into the surface of the shell or set on the special sunk underside; wherein the said special sunk underside is designed for setting in the heat radiation surface of external exothermic electronic elements. The heat conduction board is made of metal sheet or soft organic sheet with good heat conductibility, and made of rectangle or round shape or any profile matching the appearance of the heat radiation surface of the exothermic electronic elements.

Aiming at the higher requirements of heat elimination of chips brought by the fast development of LSI technology, this practical new pattern further provides a kind of technical scheme, a way of directly applying the heat pipe heat elimination method on the integrated circuit itself, and also a good way of direct heat elimination of large power transistor and high frequency transistor.

The Detailed Description:

On the basis of the scheme said above, there is one or more than one holes opened on the said shell and an element baseboard with dimensions matching the holes is embedded into the said opening holes and the periphery of the said element baseboard is tightly sealed to the said shell. The core of integrated electric circuit or electric component is laid on the surface of the said element baseboard facing the said enclosed space. The outlet line of the said core of integrated electric circuit or electric component is set up on the surface of the said element baseboard facing the outer side of the said shell.

The said fluid suction core is of electric insulation and is laid on the core of integrated electric circuit or electric element. The fluid medium is of electric insulation, and is chemical and electrical compatible with the material of the core of integrated electric circuit or electric elements.

In this scheme, the element baseboard may be the chip motherboard of integrated circuit, of which the surface SLI is put up directly in the enclosed space and in direct contact with the fluid medium, resulting in fast heat conduction without heat resistance and utmost improvement of the ability of elimination of the chips, so that the work reliability is ensured and the life-time of the chip is extended. Equally, the motherboard of large power transistor also can be taken as the said element baseboard, and the P-N junction on the surface of the motherboard is also in direct contact with the fluid medium. Thereby, this will banish the situation that in traditional way of heat elimination of transistor the heat conduction was only done through the piece of knotted bed made of insulation material that was not efficient in heat conduction, and greatly improve the efficiency of heat elimination of transistor so as to enhance the reliability and prolong the life time of transistor, especially the large power transistor and the high frequency transistor.

In conclusion from the various schemes mentioned above, this practical new pattern applies the principle of heat pipe heat conduction to form a three-dimensional heat elimination network, that is, to setup thin-wall fluid passage in a tubular shell to compose an enclosed space where the fluid medium can be vaporized and heat radiation fins in the thin-wall fluid passage, so as to realize super-thinned heat radiation fin and the fin stack highly dense, and to gain a heat elimination area far larger than traditional heat pipe radiator, thereby, to achieve optimized matching between heat elimination efficiency and the heat flux from he exothermic electronic elements. In result, it is to improve heat elimination efficiency without increasing the volume of heat radiator. In addition, this new pattern adopts simple structure and has features of swift heat transfer and even heat conduction, easy-use and high reliability, and can be transformed to various types according to the electric components in different situation, to meet the requirements of different equipments.

Furthermore, this practical new pattern can also provide an effective solution on direct heat elimination of present or future SLI and various exothermic electronic components.

FIGURE ILLUSTRATIONS

FIG. 1 illustrates a structure view according to a kind of heat pipe heat radiator at present.

FIG. 2 illustrates a principle structure view of heat pipe radiator for eliminating heat of exothermic electronic elements according to this practical new pattern

FIG. 3 illustrates end plate structure view of heat pipe radiator for eliminating heat of exothermic electronic elements according to this practical new pattern

FIG. 4 illustrates structure view of fluid suction core according to one of embodiments of this practical new pattern

FIG. 5 illustrates structure view of fluid suction core according to one of embodiments of this practical new pattern

FIG. 6 illustrates structure view of flake type fluid suction core according to one of embodiments of this practical new pattern

FIG. 7 illustrates structure view of flake type fluid suction core according to one of embodiments of this practical new pattern

FIG. 8 illustrates structure view of flake type fluid suction core according to one of embodiments of this practical new pattern

FIG. 9 illustrates view of heat pipe radiator for eliminating heat of exothermic electronic elements according to one of embodiments of this practical new pattern

FIG. 10 illustrates view of heat pipe radiator for eliminating heat of exothermic electronic elements according to one of embodiments of this practical new pattern

FIG. 11 illustrates side view according to embodiment of FIG. 10

FIG. 12 illustrates view of connection type of end plate according to one of embodiments of this practical new pattern

FIG. 13 illustrates scheme structure view of heat radiation fins according to one of embodiments of this practical new pattern

FIG. 14 illustrates scheme structure view of heat radiation fins according to one of embodiments of this practical new pattern

FIG. 15 illustrates structure view of heat resistance reduction according to one of embodiments of this practical new pattern

FIG. 16 illustrates structure view of direct heat elimination by eliminating of heat resistance according to one of embodiments of this practical new pattern.

EMBODIMENTS OF THIS PRACTICAL NEW PATTERN

The following gives further detailed descriptions through figures and according to embodiments of this practical new pattern

FIG. 2 illustrates a principle structure view of heat pipe radiator for eliminating heat of exothermic electronic elements according to this practical new pattern. The said heat pipe radiator for eliminating heat of exothermic electronic elements includes a tubular shell 5 (though illustrated rectangle in the figure, it also can be other types of shapes.), in which there setup a thin-wall fluid passage 6, of which the shape is also rectangle. The thin-wail fluid passage 6 and the shell 5 are sealed coupled along edges through two parallel 7 end plates, so as to form an enclosed space 51, which is filled with fluid medium 52 that can be vaporized in hot temperature and condensed in cold temperature.

Thin-wall fluid passage 6 is made of metal sheet with good heat conductibility and inside installed multi layers of heat radiation fins 61, which are laid close and parallel, and the sides of which are jointed to the inner wall of the thin-wall fluid passage 6. Cooling flow will lead the heat flux out through heat radiation fins 61 when flowing through the thin-wall fluid passage.

Around on the inner surface of shell 5 in the enclosed space 51 there setup fluid suction cores 8, which have gaps that can produce capillarity capable of absorbing fluid onto and spreading fluid through surfaces of the gaps.

On the end plate 7 there is a lead-in bonnet 71 designed for vacuumizing and filling of the said fluid medium 52 and it will be sealed after the enclosed space 51 is made vacuumized and filled with the said fluid medium 52.

Upon using, the heat pipe radiator for eliminating heat of exothermic electronic elements is installed on the surface of the exothermic electronic components (CPU for example), the heat flux of which, through bottom of shell 5, is transferred into fluid medium 52, which will be vaporized then, and the other part of the fluid medium that not meet the heat flux will flow supplementary into the part vaporized. The vaporized fluid medium 52 will flow up along the enclosed space 51 inside and take heat-exchange with and on the outer side of the thin-wall fluid passage 6, and then the heat flux is transferred onto the multi-layer heat radiation fins 61. When releasing heat energy, the vaporized fluid medium reduces its temperature when releasing heat and is re-coagulated into liquid state, and then returns to its original position, and continues its supplementary flowing into the fluid medium vaporized, thereby, a phase exchange circulation of fluid medium 52 flows inside the enclosed space 51, wherein the heat flux from the exothermic electronic components will be quickly eliminated.

Inside the thin-wall fluid passage 6, the closely banked multi-layer heat radiation fins 61 gains heat radiation area quite larger than the surface area of the exothermic electronic components, so as to ensure elimination of heat flux in no delay.

When electronic equipments are in state of moving (in transportation for example) or working in horizontal or upside-down position, the initial position of fluid medium 52 will be away from the position where the exothermic electronic component is in, the fluid suction core 8 will then, through the capillarity generated by its gaps inside, absorb fluid medium 52, to make the fluid medium 52 spread to place where the exothermic electronic component is in, wherein the fluid medium will be vaporized, so as to ensure a continual phase-exchange circulation of fluid medium 52.

The shape of end plate 7 adopted in this practical new pattern is just profiled by the space between the outer side of thin-wall fluid passage 6 and the inner side of shell 5, and, in the example said above, the shape of the end plate 7 is of square case frame. For the purpose of installation and guarantee of fixation and airtightness, the section of end plate 7 can be made into a shape of concavity, as illustrated in FIG. 3, in which, the surface fringes along the end plate 7 and facing around the said enclosed space are made as ledges 72, through which, it is easy to weld or conglutinate end plate 7 onto the inner wall of the shell and the outer side of the thin-wall fluid passage. The protruding direction the ledges 72 also can be outward from the enclosed space, but this will reduce the volume of the enclosed space.

The fluid suction core 8 adopted in this practical new pattern can be made as various types. The fluid suction core illustrated in FIG. 4 is composed of lapped layers of metal screen 81 by way of welding. Between the multi-layer metal screens 81 there are, or the metal screens themselves have, plenty of interspaces that can result good absorption effects.

FIG. 5 illustrates a scrap view of porous fluid suction core fabricated by powder sinter technique. This porous fluid suction core absorbs fluid by capillarity from the its inside and surface pores 82.

FIG. 6 illustrates a belt like fluid suction core composed of metal sheets that have good heat conductibility and that are made into ‘U’ shapes by alternative bending, as to form many ‘U’ shape chamfers inside the belt like fluid suction core. On the surfaces of the sheets of the belt like fluid suction core are open holes 83, which can be long or round holes or, protruded or dented gaps. This kind of belt like fluid suction core can be welded on the inner wall of the shell. Compared with other types of fluid suction cores, this kind of fluid suction core possesses good ability of capillarity absorption, and at the same time, it is a good heat conductor itself so that it can directly take part in the process of heat conduction and quickly transfer heat flux to fluid medium faraway, and proceed the process of larger area heat vaporization and elimination. Therefore, compared with the fluid suction core of multi-layer metal screen, the porous fluid suction core made of powder sinter technique has better heat elimination effect.

The belt like fluid suction core also can be such made as illustrated in FIG. 7 that the said sheets are made into ‘V’ shape through alternative folding and bending, or as illustrated in FIG. 8 that the sheet are made into to ‘O’ shape. As illustrated in FIG. 7 and FIG. 8, holes 83 are opened on the surfaces of the belt like fluid suction cores, for the purpose of vaporization of fluid medium through the surfaces.

The fluid medium can easily spread inside holes 83, and several physically formed ‘U’ shape chamfer, ‘V’ shape chamfer, and ‘O’ shape chamfer, as illustrated in FIG. 6, FIG. 7, and FIG. 8, separately.

For the sake of easy vaporization and dispersion the end openings, of the ‘U’ shape chamfer, ‘V’ shape chamfer, and ‘O’ shape chamfer, can be sealed.

FIG. 9 illustrates an embodiment with two thin-wall fluid passages according to this practical new pattern. As illustrated in FIG. 9, the two thin-wall fluid passages 6 are all made into shapes of rectangle in accordance with shell 5. The profile of end plate (not illustrated in the figure) is identical to the shape so formed between the two thin-wall fluid passages 6 and shell 5 and the way of their enclosure and connections are the same as the structure said above.

In this embodiment, inside the thin-wall fluids passage 6, there are several thin-wall heat pipes 62 made of metal material. The thin-wall heat pipes 62 directly run through the said heat radiation fins 61 and are closely coupled with them. The two ends of the thin-wall heat pipe are fixed on the inner wall of the thin-wall fluid passage and run through with enclosed space 51.

The setup of thin-wall heat pipe 62 can provide support for the closely banked heat radiation fins 61 and increase the heat exchange area of heat radiation fins 61, and on the other hand, enlarge the volume of the enclosed space 51. All these will give advantages for heat transfer to outside by vaporized fluid medium and speed up the phase-exchange of fluid medium from gaseity state to liquid state, thereby, to increase the total heat elimination efficiency of the heat pipe radiator for exothermic electronic elements.

FIG. 10 illustrates a structure view of round shape shell according to another embodiment of this practical new pattern. In this embodiment, the shell 5 is of round shape, the bottom of which is plane (for the convenience of close installation on the surface of chips of integrated circuit, and inside of which there setup 10 thin-wall fluid passages 6 of shapes alike the valvular orange. The heat radiation fins 61 inside the thin-wall fluid passage 6 are closely archwise deployed. This embodiment has fairly good heat elimination effects. And the round shape shell can be easily equipped with forced cooling fan, to effect faster heat elimination speed. In order to make higher heat elimination efficiency of the cooling air from the forced cooling fan, mounted on the edge of shell 5 is a match designed lead-in bonnet 53, which will lead cooling flow into the thin-wall fluid passage 6, and the shape of which is identical to the profile of shell 5 (as illustrated in FIG. 11). The inside of let-in bonnet 53 is cone-shaped with outer end larger than the inner end that when the forced cooling fan is installed on the outer end of the lead-in bonnet and blows wind into the thin-wall fluid passage, fastigiated cant of the lead-in bonnet 53 is capable of leading more cooling wind into the thin-wall fluid passage 6, thus to enhance the heat elimination efficiency.

In this embodiment, for the purpose of improving total the structure strength of the heat radiator, inside the enclosed space 51 there setup three layers of enforced boards 54, the shapes of which are identical to the front projection of enclosed space 51 on the axes direction of shell 5, that is, identical to the profile of end plate 7 and parallel to the end plate 7. In addition, there is an opening hole or indentation designed on enforced board 54, for the flow of fluid medium, so that the fluid medium will not be interfered in its phase-exchange circulation.

In the embodiment of the heat pipe radiator for eliminating heat of exothermic electronic elements said above, the connection of endplate to the edges of the shell and the thin-wall fluid passage can also adopt another way illustrated in FIG. 12 (only a structure view of connection between end plate and the shell shown), in which the edge of end plate 7 and the edge of shell 5 can be is joggle-joint connected by way of hemming, and fixed by welding or conglutination on the junctions, too. The joint of edges of end plate 7 and thin-wall fluid passage can also adopt this way of connection, which is suitable for large-scale industrial fabrication of some of the heat pipe radiators, and which can gain larger enclosed space and that larger enclosed space is advantageous in vaporization of fluid medium and its heat conduction.

Why this practical new pattern has heat elimination effect is that the heat radiation funs are epitomized designed and made of metal sheets by detailed technique scheme according to embodiments of this practical new pattern, as illustrated in FIG. 13.

The embodied scheme of the setup of heat radiation fins is illustrated in FIG. 13, in which heat radiation fins 61 are made of metal sheets, which are alternative banded as ‘Z’ shape to form a heat radiation fin bank that will be installed in thin-wall fluid passage 6. Among heat radiation fins 61 there setup a supporting board 63, which is made of metal material, and which will run vertically through heat radiation fins 61 and be welded, by its upper and lower edges, on the inner wall of thin-wall fluid passage 6 while heat radiation fins 61 and supporting board 63 are closely welded. Furthermore, the bended ends of heat radiation fins 61 are separately welded to inner wall of thin-wall fluid passage 6. In this way, the metal sheet with thickness thin as possible is preferred to make heat radiation fins and yet the structural strength of heat radiation fins will not be influenced.

FIG. 14 illustrates another embodiment scheme of the setup of heat radiation fins, wherein heat radiation fins are made such that the metal sheets are made undee and setup parallel and formed as a bank to be fixed on the inner wall of thin-wall fluid passage 6. Several upright barbs 611 are designed on each of the heat radiation fin. When cooling fluid flows through thin-wall fluid passage 6, the undee heat radiation fins 61 can make the fluid flowing undulate that this is just to prolong the contact time with the surface of heat radiation fins and heighten the heat radiation ability, moreover, the upright barbs 611 can make turbulent flow of the cooling fluid so that the cooling fluid can bring out more heat flux.

In addition, some bypass holes can be opened on the surfaces of heat radiation fins 61, for cooling fluid flowing by, thus to enhance heat radiation efficiency as could as possible.

The two schemes illustrated in FIG. 13 and FIG. 14 cannot only enlarge the heat radiation area effectively but also provide a space volume in the thin-wall fluid passage for the cooling fluid to flow. And this space volume is usually two times larger than enclosed space volume. When making the heat pipe radiator for smaller exothermic electronic elements, because the heat elimination area could not be enlarged infinitely, so the two schemes can increase the space volume for the cooling fluid as could as possible.

The shell inn this practical new pattern can be fabricated by using metal material, or engineering plastics as to make batch production. When applying engineering plastics, for the purpose of reducing contact heat resistance, the shell can be fixed with heat conduction board, which can be closely coupled to the heat radiation surface of the exothermic electronic elements.

The heat conduction board can be embedded directly into the shell, or when a sunk is opened on the surface of the shell, the heat conduction board can be taken as underside of the sunk, and when doing so, the heat conduction board has already stretched into the enclosed space, so as to reduce heat resistance that the contact heat transfer method in the past had. FIG. 15 illustrates an embodiment where the heat conduction board is already extended into the enclosed space. In FIG. 15, a sunk 55 is opened on underside of shell 5, designed for embrace IC chips (computer chips), and the underside of sunk 55 is just the said heat conduction board 56. sunk 55 is inside enclosed space 51 and fluid suction core is setup on the other side of heat conduction board 56, moreover, sunk 55 is totally exposed in fluid medium 52. this kind of layout can make the heat flux from chips be easily eliminated through fluid medium 52, and that, the heat elimination efficiency is fairly high.

Heat conduction board 56 can be made of metal plate or soft organic plate, all with very good heat conductivity. Soft organic plate, under certain installation pressure, can be closely jointed to the surface of a chip, so that heat flux from chips can be quickly transferred into fluid medium 52.

Heat conduction board 56 and sunk 55 also can be shaped into rectangle, round or other forms according to specific profiles of the exothermic electronic elements, moreover, in this way, several sunks 55 can be made on shell 5 so as to make an integrated heat pipe radiator for eliminating heat of exothermic electronic elements.

In order to thoroughly eliminate heat resistance in the process of heat elimination of the exothermic electronic elements, the heat source of exothermic electronic elements can be directly immersed into the fluid medium, and the embodiments as the following:

For reference of FIG. 16, on the underside of shell 5 there setup hole 57, in which a component baseboard 9, with its dimensions matching hole 57, is embedded, and the fringes of are closely coupled to shell 5. On the surface of component baseboard 9 in the enclosed space 51, there setup integrated circuit 91, of which several eduction ends 92 protruding out through component baseboard 9 can be installed directly on circuit board. Integrated circuit 91 is straightly immersed in fluid medium 52 and fluid suction core is laid on the surface of integrated circuit 91. In this embodiment, fluid suction core can be made of nonmetal material of electric insulation and the fluid medium is also of electric insulation, and chemical and electrical compatible with integrated circuit 91.

The other structure of this embodiment is the same as that in the embodiment said above. In practice, the heat flux from integrated circuit 91 is directly transferred into fluid medium 52 that the heat elimination efficiency reaches to its maximum and that it eliminates the heat resistance in heat transfer. In practical production, the operations are that it is first to fabricate integrated circuit 91 on the surface of component baseboard 9, and then to fix and seal component baseboard 9 into opening hole 57 ready made on shell 5, at last, to vaporize enclosed space 51 and fill it with fluid medium 52.

By way of method said above, several component baseboards 9 can be installed on the surface of shell 5, so as to make an integrated heat pipe radiator for integrated heat elimination of exothermic electronic elements with many chips.

This embodiment also can be applied to fabricate large-power transistor that itself possesses heat pipe radiator for eliminating heat of exothermic electronic elements and integrated heat pipe radiator for integrated heat elimination of exothermic electronic elements with many transistors. In production, it is only need to solidify P-N knot on the surface of component baseboard 9 so that the heat flux from P-N junction can be radiated directly through fluid medium 52, thereby, this solves the problem that in the past, the heat flux could only be led out through insulation substance on the P-N pedestal, a substance that had lower heat conduction efficiency, resulting in damage of transistors because of bad heat radiation effect.

Finally, what should be clarified is: the above embodiments are only cited to explain but not confine the technical schemes according to this practical new pattern. Through this practical new pattern has been explained in detail through references of the embodiments above, the common technicians should understand: this practical new pattern may still be modified or equally substituted, and any modifications or partial substitutions, which not deviate from the essences and scopes, all should be covered within the claims of this practical new pattern. 

1. A kind of heat pipe radiator for eliminating heat of exothermic electronic elements, including a tubular shell, characterized by: It also includes a tubular thin-wall fluid passage, which is set up inside the said shell, and the edge of which is sealed coupled to the edge of the said shell through end plate; Wherein an enclosed space, profiled by the inner wall of the said shell and the outer side of the said thin-wall fluid passage, is filled with working fluid medium; Heat radiation fins are set inside the said thin-wall fluid passage; Wherein a fluid suction core having gaps is laid on the inner side of the said shell in the said enclosed space; Wherein fabricated on the said end plate or on the said shell is a lead-in bonnet, which sealed and designed for vacuumizing and filling of the said fluid medium.
 2. A kind of heat pipe radiator for eliminating heat of exothermic electronic elements according to claim 1, further characterized by: The said fluid suction core is composed of webbed multi-layer fiber or laminated metal mesh, or micro-pored plate like body of sintered powder material, or belt body of metal or organic sheets being shaped by way of alternative folding or bending, wherein holes are fabricated on the surface of the sheets, and the fluid suction core can be laid on the inner wall of the said shell by way welding or conglutinating.
 3. A kind of heat pipe radiator for eliminating heat of exothermic electronic elements according to claim 2, further characterized by: The said belt body is made of the said sheets made of ‘U’ or ‘V’ or ‘O’ shape through alternative folding or bending, to form several ‘U’ or ‘V’ or ‘O’ shaped chamfers in the said belt body; wherein the said holes should be slotted hole or round hole or protruding gap, and even distributed on the surface of the said sheets.
 4. A kind of heat pipe radiator for eliminating heat of exothermic electronic elements according to claims 1-3, further characterized by: The said thin-wall fluid passage applied may be one or more; wherein the said end plate is sealed coupled to edges of several thin-wall fluid passages and the edge of the said shell.
 5. A kind of heat pipe radiator for eliminating heat of exothermic electronic elements according to claim 4, further characterized by: Being tube style, the said thin-wall fluid passage is made of metal material having fairly good heat conduction and shaped into rectangle or round or hexagon; wherein, within the said thin-wall fluid passage, the vacuum volume for cooling fluid to flow through should be two times larger than the said enclosed space volume.
 6. A kind of heat pipe radiator for eliminating heat of exothermic electronic elements according to claim 4, further characterized by: There is one or more supporting bar or board of metal material set up in the said thin-wall fluid passage; wherein the said supporting bar or board goes through the said heat radiation fins and is fixed on the inner wall of the said thin-wall fluid passage; wherein the said heat radiation fins are tightly jointed with the said supporting bar or board.
 7. A kind of heat pipe radiator for eliminating heat of exothermic electronic elements according to claim 4, further characterized by: There is one or more thin-wall heat pipe set up inside the said thin-wall fluid passage, wherein the thin-wall heat pipe goes through the said heat radiating fins and is closely coupled with the said heat radiation fins, wherein the two ends of the said thin-wall heat pipe are fixed on the inner wall of the said thin-wall fluid passage and run through the said enclosed space.
 8. A kind of heat pipe radiator for eliminating heat of exothermic electronic elements according to claim 1-3 or 5-7, further characterized by: Ledges are made on the peripheral surface of the said end plate, for the purpose of welding or conglutinating onto the inner wall of the said shell and the outer surface of the said thin-wall fluid passage.
 9. A kind of heat pipe radiator for eliminating heat of exothermic electronic elements according to claim 1-3 or 5-7, further characterized by: The edge of the said end plate is joggle-joint connected to the edge of the said shell and/or the edge of the said thin-wall fluid passage by way of hemming, and the connection is fixed by welding or conglutinating.
 10. A kind of heat pipe radiator for eliminating heat of exothermic electronic elements according to claim 1, further characterized by: The said heat radiation fins is just a group of heat radiation fin stack made of metal sheets, which shaped undee, or formed into ‘Z’ shape by alternative folding.
 11. A kind of heat pipe radiator for eliminating heat of exothermic electronic elements according to claim 10, further characterized by: On the surfaces of the said heat radiation fins there set up more than one pass-by holes for cooling fluid to flow, or upright barbs on the surfaces to make turbulent flow.
 12. A kind of heat pipe radiator for eliminating heat of exothermic electronic elements according to claim 1-3 or 5-7 or 10 or 11, further characterized by: 